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HSCC HE2750
- High-performance PA6 with excellent strength
- Low moisture absorption for dimensional stability
- Ideal for automotive, electronics, and industrial applications
- Excellent electrical performance
- Good thermal stability and high heat resistance
Product Overview
HSCC HE2750 is a high-performance Polyamide 6 (PA6) resin designed for a wide range of applications that require excellent mechanical properties, good processability, and reliable electrical insulation.
This grade is ideal for automotive, electrical, and industrial applications where both durability and electrical performance are crucial. Its low moisture absorption and high heat resistance ensure stable performance in demanding environments.
Key Properties
Excellent Mechanical Strength: High flexural modulus and balanced toughness
Good Processability: Consistent melt flow and low molding shrinkage
Low Moisture Absorption: Enhanced dimensional stability in humid environments
Good Electrical Performance: Suitable for insulating components
High Heat Resistance: Suitable for high-temperature applications up to melting point range
Typical Applications
Automotive: Interior parts, functional components, and structural elements
Electrical: Insulation parts, connectors, and housings
Industrial: Mechanical components, gears, and bearings
Consumer Goods: Housings, covers, and structural parts
Technical Data (Typical Values)
Material Specific Properties
| Property | Value | Test Standard |
|---|---|---|
| Relative Viscosity (96% H₂SO₄) | 2.750 ± 0.07 | ISO 307:2019 |
| Density | 1.130 g/cm³ | ISO 1183-1:2004 |
| Moisture Content | < 0.06 % | ISO 15512:2019 |
| Water Absorption (23°C, 50% RH) | 0.28 % | ISO 62:2008 Method 4 |
| Amino End Group | 27 ± 4 mmol/kg | GB/T 38138-2019 (internal) |
| Extractables | < 0.6 % | ISO 6427:2013 |
Mechanical Properties
| Property | Value | Test Standard |
|---|---|---|
| Flexural Strength | 100 MPa | ISO 178:2001 |
| Flexural Modulus | 2530 MPa | ISO 178:2001 |
| Hardness (L Scale) | 99 L | ISO 2039-2:1987 |
| Molding Shrinkage (Parallel) | 1.2 % | ISO 294-4:2001 |
| Molding Shrinkage (Vertical) | 1.2 % | ISO 294-4:2001 |
| Nominal Tensile Strain at Break | 32 % | ISO 527-1:2012 |
| Notched Izod Impact | 85.9 J/m | ASTM D256-2023eI |
| Charpy Notched Impact Strength | 3.0 kJ/m² | ISO 179-1:2000 |
Electrical Properties
| Property | Value | Test Standard |
|---|---|---|
| Surface Resistivity | 3.87 × 10¹⁵ Ω | IEC 62631-3-2:2015 |
| Volume Resistivity | 5.71 × 10¹² Ω·m | IEC 62631-3-1:2016 |
| Dielectric Constant | 2.9 | IEC 60250:1969 |
Thermal Properties
| Property | Value | Test Standard |
|---|---|---|
| Melt Mass-Flow Rate (MFR) | 19.6 g/10 min | ISO 1133-1:2011 |
| Melting Temperature | 215–225 °C | ISO 3146:2022 |
| Heat Distortion Temperature | 58 °C | ISO 75-1:2013 & ISO 75-2:2013 |
Why Choose HSCC HE2750
High Mechanical Strength: High flexural modulus and toughness for durable applications
Good Processability: Reliable melt flow for consistent injection molding performance
Low Moisture Absorption: Maintains dimensional stability even in humid environments
Electrical Insulation: Ideal for electrical components and housings
High Heat Resistance: Suitable for high-temperature applications
