HSCC HE2700 is a high-performance Polyamide 6 (PA6) engineered to deliver superior mechanical strength, impact resistance, and low moisture absorption.
This grade is specifically designed for demanding applications in automotive, electrical, and industrial sectors, where both durability and electrical insulation are critical. With consistent melt flow, it is suitable for injection molding and extrusion applications.
High Mechanical Strength: Excellent flexural modulus and elongation
Good Impact Resistance: Suitable for tough, shock-loaded components
Low Moisture Absorption: Ensures dimensional stability in humid environments
Superior Electrical Insulation: Suitable for electronic and electrical applications
Easy Processing: Reliable melt flow for efficient molding and extrusion
Automotive: Under-hood and structural components
Electrical: Connectors, housings, and insulation components
Industrial: Gears, bearings, mechanical parts
Consumer Goods: Engineering parts for household appliances
| Property | Value | Test Standard |
|---|---|---|
| Density | 1.12 g/cm³ | ISO 1183/A |
| Melt Mass-Flow Rate (MFR) | 21 g/10 min | ISO 1133 |
| Water Absorption (23°C, 50% RH) | 0.29 % | ISO 62 |
| Molding Shrinkage | 1.2 % | ISO 294-4 |
| Property | Value | Test Standard |
|---|---|---|
| Tensile Strain at Break | 42 % | ISO 527-2 |
| Flexural Modulus | 2640 MPa | ISO 178 |
| Flexural Stress | 114 MPa | ISO 178 |
| Rockwell Hardness (L-Scale) | 98 | ISO 2039-2 |
| Property | Value | Test Standard |
|---|---|---|
| Charpy Notched Impact | 7.7 kJ/m² | ISO 179 |
| Notched Izod Impact | 61 J/m | ASTM D256 |
| Property | Value | Test Standard |
|---|---|---|
| Melting Temperature (DSC) | 215–225 °C | ISO 3146 |
| Heat Distortion Temperature | 63 °C | ISO 75-2 |
| Property | Value | Test Standard |
|---|---|---|
| Surface Resistivity | 8.9 × 10¹⁵ Ω·cm | IEC 62631-3-2 |
| Volume Resistivity | 1.3 × 10¹⁴ Ω·m | IEC 62631-3-1 |
| Dielectric Constant | 3.42 | IEC 60250 |
High Mechanical Strength: Ideal for structural applications requiring high strength and rigidity
Impact Resistance: Performs well under shock-loaded conditions
Low Moisture Absorption: Ensures stable dimensions and performance in humid environments
Superior Electrical Insulation: Suitable for electronic components and electrical housings
Easy Processing: Reliable melt flow for molding and extrusion applications