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HSCC HE2400
- High melt flow polyamide
- Excellent processability for thin-walled parts
- High mechanical strength and toughness
- Low moisture absorption for dimensional stability
- Suitable for automotive, electronic, and fast-cycle molding applications
Product Overview
HSCC HE2400 is a Polyamide 6 (PA6) resin featuring high melt flow and balanced mechanical properties, designed for applications requiring fast cycle times and dimensional stability.
This resin offers excellent processability, allowing for complex and thin-walled parts to be molded efficiently. It also provides good mechanical strength, low moisture absorption, and electrical insulation properties, making it suitable for automotive, electronics, and consumer goods applications.
Key Properties
High Melt Flow: Excellent for injection molding of thin-walled and complex parts
Good Mechanical Strength: High flexural modulus and impact resistance
Low Moisture Absorption: Enhanced dimensional stability in humid conditions
Electrical Insulation: Suitable for electronic applications
Low Shrinkage: Consistent part dimensions and tight tolerances
Typical Applications
Thin-wall electrical components and connectors
Automotive interior and functional parts
Consumer goods and household appliances
Fast-cycling injection molded parts
Technical Data (Typical Values)
Material Specific Properties
| Property | Value | Test Standard |
|---|---|---|
| Relative Viscosity (96% H₂SO₄) | 2.460 ± 0.07 | ISO 307:2019 |
| Density | 1.129 kg/m³ | ISO 1183-1:2004 |
| Moisture Content | < 0.06 % | ISO 15512:2019 |
| Water Absorption (23°C, 50% RH) | 0.28 % | ISO 62:2008 Method 4 |
| Amino End Group | 38 ± 4 mmol/kg | GB/T 38138-2019 (internal) |
| Extractables | < 0.6 % | ISO 6427:2013 |
Mechanical Properties
| Property | Value | Test Standard |
|---|---|---|
| Flexural Strength | 105 MPa | ISO 178:2001 |
| Flexural Modulus | 2560 MPa | ISO 178:2001 |
| Hardness (L Scale) | 98 L | ISO 2039-2:1987 |
| Molding Shrinkage (Parallel) | 1.0 % | ISO 294-4:2001 |
| Molding Shrinkage (Vertical) | 1.2 % | ISO 294-4:2001 |
| Nominal Tensile Strain at Break | 30 % | ISO 527-1:2012 |
| Notched Izod Impact | 78.2 J/m | ASTM D256-2023eI |
| Charpy Notched Impact Strength | 8.3 kJ/m² | ISO 179-1:2000 |
Electrical Properties
| Property | Value | Test Standard |
|---|---|---|
| Surface Resistivity | 2.20 × 10¹⁵ Ω | IEC 62631-3-2:2015 |
| Volume Resistivity | 3.06 × 10¹² Ω·m | IEC 62631-3-1:2016 |
| Dielectric Constant | 2.9 | IEC 60250:1969 |
Thermal Properties
| Property | Value | Test Standard |
|---|---|---|
| Melt Mass-Flow Rate (MFR) | 40.6 g/10 min | ISO 1133-1:2011 |
| Melting Temperature | 215–225 °C | ISO 3146:2022 |
| Heat Distortion Temperature | 59 °C | ISO 75-1:2013 & ISO 75-2:2013 |
Why Choose HSCC HE2400
High Melt Flow: Excellent for thin-walled and complex parts requiring fast cycle times
Good Mechanical Strength: High flexural modulus and impact resistance for durable components
Low Moisture Absorption: Ensures dimensional stability even in humid environments
Electrical Insulation: Suitable for electronic applications where electrical properties are critical
Low Shrinkage: Provides consistent and reliable part dimensions
