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HSCC HE2500
- High flow PA6 for fast injection molding
- Ideal for thin-wall applications
- Low moisture absorption for dimensional stability
- Good thermal stability for standard processing temperatures
- Suitable for automotive, electronics, and consumer goods
Product Overview
HSCC HE2500 is a high-flow Polyamide 6 (PA6) resin engineered for high-speed injection molding and thin-wall components.
It offers excellent processability, making it ideal for fast cycle times, and its low moisture absorption ensures dimensional stability. With good thermal stability, it performs reliably in standard PA6 processing temperatures, making it suitable for a wide range of industrial applications.
Key Properties
High Melt Flow: Optimized for fast injection molding and thin-wall parts
Low Moisture Absorption: Good dimensional stability in humid conditions
Good Thermal Stability: Suitable for processing at standard PA6 temperature ranges
Consistent Amino End Group: Ensures stable reactivity and processing behavior
Typical Applications
High-speed injection molded components
Thin-wall electrical and electronic parts
Consumer goods and packaging components
Automotive interior and functional parts
Technical Data (Typical Values)
Physical Properties
| Property | Value | Test Standard |
|---|---|---|
| Melt Mass-Flow Rate (MFR) | 38 g/10 min | ISO 1133 |
| Relative Viscosity (96% H₂SO₄) | 2.41–2.55 cm³/g | — |
| Moisture Content | < 0.060 % | ISO 15512 |
| Extractables | < 0.6 % | ISO 6427 |
Thermal Properties
| Property | Value | Test Standard |
|---|---|---|
| Melting Temperature (DSC) | 215–225 °C | ISO 3146 |
Material Characteristics
| Property | Value | Test Standard |
|---|---|---|
| Amino End Group Content | 42–50 mmol/kg | GB/T 38138-2019 |
Why Choose HSCC HE2500
High Melt Flow: Perfect for fast injection molding and thin-wall applications
Low Moisture Absorption: Ensures consistent dimensional stability, especially in humid conditions
Good Thermal Stability: Reliable in standard PA6 processing temperatures
Stable Amino End Group Content: Consistent reactivity and processing behavior
Ideal for High-Productivity Applications: Perfect for automotive, consumer goods, and electronics manufacturing
