Product Overview

Eastech PC/ABS CS100 is a high-impact, high-heat PC+ABS alloy engineered for durable and reliable applications. By combining the toughness of polycarbonate with the processability of ABS, CS100 delivers a balanced performance profile suitable for 3C consumer electronics, shared bicycle components, and appliance housings.

This grade offers excellent impact strength, reliable thermal resistance, and smooth molding behavior—making it a versatile material for both indoor and outdoor equipment requiring durability and stability.

Key Features

• High impact strength ideal for electronics and outdoor-use products
• Good thermal performance with Vicat softening temperature of 105°C
• Excellent flowability for molding thin-wall or complex structures
• Balanced stiffness and strength for structural housings
• Stable processing with predictable shrinkage
• HB flame rating suitable for consumer, industrial, and mobility applications

Typical Applications

• 3C electronic housings（computers, communication devices, consumer electronics）
• Shared bicycle components, covers, and structural panels
• Home appliance housings and protective shells
• Outdoor equipment, tool covers, and ruggedized cases
• General-purpose high-impact molded components

Key Material Properties（Optimized Text Layout）

Physical Performance

• Density（23°C）：1.08 g/cm³（ISO 1183）
• Melt Mass-Flow Rate（260°C / 5 kg）：25 g/10 min（ISO 1133）
• Molding Shrinkage：0.4–0.7%（ISO 294-4）

Mechanical Performance

• Tensile Strength at Yield：48 MPa（ISO 527）
• Strain at Break：20%（ISO 527）
• Flexural Strength：75 MPa（ISO 178）
• Flexural Modulus：2000 MPa（ISO 178）

Impact Resistance

• Izod Notched Impact（23°C）：30 kJ/m²（ISO 180/1A）

Thermal Performance

• Vicat Softening Temperature（B50）：105°C（ISO 306）
• Heat Deflection Temperature（1.8 MPa）：86°C（ISO 75）

Flame Rating

• UL 94：HB（1.5 mm）

Why Choose CS100

• Combines toughness + heat resistance for a wide range of applications
• Ideal material for both electronics and outdoor mobility devices
• Smooth molding behavior suitable for complex and thin-wall design
• Strong structural integrity for durable housings and covers
• Cost-effective performance for high-volume injection molding