Sanning PA6 SN2705B is a high-quality Polyamide 6 (PA6) resin supplied in bright chip form. This grade is characterized by consistent viscosity, low moisture content, and minimal extractables, making it ideal for fiber spinning, film production, and high-purity compounding applications.
It is designed for industries that require consistent polymerization, high tenacity fibers, and premium-grade compounds, providing superior processing stability and product quality.
High Purity: Low extractables and moisture for consistent processing
Uniform Viscosity: Ensures stable polymerization and smooth spinning
Bright Chip Form: Enhances appearance and handling for downstream applications
Low Irregular Chip Content: Ensures smooth processing and high-quality products
Excellent Processing Performance: Suitable for high-speed extrusion and spinning processes
High-Tenacity Fiber and Filament Spinning: Ideal for industrial-grade fibers
Biaxially Oriented Film (BOPA): Used in flexible packaging and barrier films
Premium-Grade Injection Molding and Extrusion Compounds: High-quality parts for automotive, electronics, and consumer goods
Masterbatch and High-Purity Compounding: For demanding formulations and additives
| Property | Value | Test Standard |
|---|---|---|
| Relative Viscosity (25°C, 96% H₂SO₄) | 2.74 | Internal Method |
| Moisture Content | 0.04 % | Internal Method |
| Hot Water Extractables | 0.27 % | Internal Method |
| Irregular Chip Content | 0.0 pcs/100g | Internal Method |
| Property | Value | Test Standard |
|---|---|---|
| Tensile Strength | 80 MPa | ISO 527 |
| Elongation at Break | 250 % | ISO 527 |
| Flexural Modulus | 2400 MPa | ISO 178 |
| Property | Value | Test Standard |
|---|---|---|
| Melting Point | 220–230°C | ISO 3146 |
| Heat Deflection Temperature | 60°C | ISO 75-2 |
High Purity: Ensures minimal extractables and moisture for stable processing and consistent results
Consistent Viscosity: Optimized for controlled polymerization and spinning
Bright Chip Form: Enhances handling and processing ease for downstream applications
Low Irregular Chip Content: Minimizes production defects and ensures product quality
Versatile Applications: Ideal for fiber, film, injection molding, and premium compounding